Samsung Electronics has begun mass manufacturing of HBM4 high-bandwidth reminiscence and has shipped industrial merchandise to clients, transferring early into the HBM4 market.
The corporate used its sixth-generation 10 nanometre-class DRAM course of, referred to as 1c, to succeed in secure yields from the beginning of mass manufacturing with out extra redesigns.
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Samsung experiences its HBM4 delivers a processing velocity of 11.7 gigabits per second (Gbps), above an trade customary of 8Gbps. It additionally experiences a 1.22 occasions enhance over the utmost pin velocity of 9.6Gbps for HBM3E, and states the design can attain as much as 13Gbps to scale back information bottlenecks as AI fashions scale.
The corporate claimed that HBM4 will increase whole reminiscence bandwidth per stack by 2.7 occasions in contrast with HBM3E, reaching as much as 3.3 terabytes per second.
Utilizing 12-layer stacking, Samsung will provide HBM4 in capacities from 24GB to 36GB. The corporate plans to align capability choices with buyer schedules through the use of 16-layer stacking to supply as much as 48GB.
To deal with energy consumption and thermal constraints linked to a doubling of information I/Os from 1,024 to 2,048 pins, Samsung has built-in low-power design measures into the core die.
It experiences a 40% enchancment in energy effectivity by low-voltage through-silicon by way of expertise and energy distribution community optimisation. In contrast with HBM3E, Samsung additionally highlighted a ten% enchancment in thermal resistance and a 30% enhance in warmth dissipation.
Samsung hyperlinks the efficiency, power effectivity and reliability of HBM4 to increased GPU throughput in information centres and improved administration of whole price of possession.
On manufacturing, Samsung factors to manufacturing assets, together with DRAM capability and devoted infrastructure, as a foundation for provide chain resilience amid rising demand for HBM4. It additionally highlights design expertise co-optimisation between its foundry and reminiscence companies as an element supporting high quality and yields, and cites in-house superior packaging capabilities as a method to shorten manufacturing cycles and scale back lead occasions.
Samsung govt vice chairman and reminiscence growth head Sang Joon Hwang mentioned: “As a substitute of taking the traditional path of utilising present confirmed designs, Samsung took the leap and adopted probably the most superior nodes just like the 1c DRAM and 4nm logic course of for HBM4.
“By leveraging our course of competitiveness and design optimisation, we’re capable of safe substantial efficiency headroom, enabling us to fulfill our clients’ escalating calls for for increased efficiency, once they want them.”
Samsung plans to broaden technical partnerships with key companions following discussions with international graphic processing unit (GPU) producers and hyperscalers engaged on next-generation application-specific built-in circuit (ASIC) growth.
Wanting forward, Samsung expects its HBM gross sales to greater than triple in 2026 in contrast with 2025 and is increasing HBM4 manufacturing capability. Following the market introduction of HBM4, the corporate expects sampling for HBM4E to start within the second half of 2026, and customized HBM samples to succeed in clients in 2027 based mostly on particular person specs.
The HBM4 replace comes after Samsung reported monetary outcomes for the fourth quarter and monetary 12 months 2025. For the quarter ended 31 December 2025, the corporate posted quarterly consolidated income of Won93.8tn ($64.9bn), a 9% enhance quarter on quarter, and working revenue of Won20.1tn.
Samsung’s income for the complete 12 months was Won333.6tn, whereas working revenue was WON43.6tn.
The corporate’s System Options division recorded a 33% quarter-on-quarter gross sales enhance, with the reminiscence enterprise setting file quarterly income and working revenue. This was pushed by expanded gross sales of HBM and different merchandise, in addition to increased market costs.
The System Options division recorded quarterly consolidated income of Won44tn and working revenue of Won16.4tn for the fourth quarter of 2025.
Within the fourth quarter of 2025, regardless of restricted provide availability, Samsung reported the reminiscence enterprise met robust standard DRAM demand whereas increasing HBM gross sales amid increased costs. The enterprise targeted on profitability by increased gross sales of merchandise together with HBM, server DDR5 and enterprise stable state drives (SSDs).
In 2026, Samsung signifies the reminiscence enterprise will preserve shut buyer partnerships and goals to fulfill demand by shipments of HBM4 and expanded gross sales of AI-related merchandise together with DDR5, SOCAMM2 and GDDR7. It additionally plans to focus on AI-related NAND demand by scaling gross sales of high-performance TLC merchandise for inference-focused SSD demand.
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